Analysis of the influence of local electrodeposition conditions on the accuracy of electrochemical 3D-printing
DOI:
https://doi.org/10.20535/kpisn.2023.1-2.289350Keywords:
адитивне виробництво, електропровідність, склад електроліту, поляризація, локальне електроосадженяAbstract
Problem. Additive manufacturing of metal parts by local electrodeposition is a new promising area with several unique features. The use of electrolysis makes it possible to manufacture metal parts at room temperature with high accuracy and low energy consumption. The accuracy and speed of electrochemical 3D printing are inversely related, and therefore it is important to find optimal electrodeposition conditions at maximum speed without degrading accuracy.
The aim of the study. The purpose of this work was to analyse the influence of electrodeposition parameters (electrode distance, electrical conductivity and electrolyte polarization) on the accuracy of metal deposit formation in a computer model and to conduct experimental verification of optimal conditions for electroforming a real object from copper sulphate electrolyte.
Methodology of implementation. To achieve the goals of the study, computer simulation of the electrochemical deposition process in the COMSOL Multiphysics software and electrochemical measurements of the characteristics of copper sulphate electrolytes were used.
Research results. Computer simulation established optimal conditions: the distance between the edge of the capillary and the surface on which deposition occurs is not more than 0.5 mm, the electrolyte in which the inverse slope of the cathode polarization curve is not lower than 2000 mA/(V×cm2) and the electrical conductivity is not higher than 0.02 S/сm. The influence of the electrolyte composition on the inverse polarization of the cathode process and its electrical conductivity was investigated. The optimal composition of the electrolyte was selected, containing 200 g/L CuSO4, 60 g/L H2SO4, 0.2 g/L KCl and RUBIN T-200 additive. In the selected electrolyte, the value of the inverse slope of the cathode polarization curve is 2120 mA/(V×cm2). Verification of the process of local electrodeposition in the selected electrolyte during the electroformation of a cylindrical object with a diameter of 4 mm and a height of 100 μm was carried out. It was determined that no more than 5 % of metal was deposited outside the capillary of the working electrode.
Conclusions. The results of the work can be used to create an electrochemical 3D printing system. Further research should be aimed at approbation of the obtained parameters of local electrodeposition in an installation that simulates the operation of a 3D printer and establish the accuracy and speed of printing of a three-dimensional object.
Key words: additive manufacturing, electrical conductivity, electrolyte composition, polarization, local electrodeposition.
References
I. Gibson, D. Rosen, B. Stucker, Additive Manufacturing Technologies, Springer, New York, USA, 2010, p. 472. https://doi.org/10.1007/978-1-4419-1120-9
L. E. Murr, S. M. Gaytan, D. A. Ramirez, E. Martinez, J. Hernandez, K. N. Amato, P. W. Shindo, F. R. Medina, R. B. Wicker, Metal fabrication by additive manufacturing using laser and electron beam melting technologies, Journal of Materials Science & Technology 28 (2012) 42-54. https://doi.org/10.1016/S2238-7854(12)70009-1
W. E. Frazier, Metal additive manufacturing: a review, Journal of Materials Engineering and Performance 23 (2014) 1917-1928. https://doi.org/10.1007/s11665-014-0958-z
D. Herzog, V. Seyda, E. Wycisk, C. Emmelmann, Additive manufacturing of metals, Acta Materialia 117 (2016) 371-392. https://doi.org/10.1016/j.actamat.2016.07.019
C. Körner, Additive manufacturing of metallic components by selective electron beam melting—a review. International Materials Reviews 61 (2016) 361-377. https://doi.org/10.1080/09506608.2016.1176289
T.M. Braun, D.T. Schwartz. The emerging role of electrodeposition in additive manufacturing. The Electrochemical Society Interface 25 (2016) 69-73. https://doi.org/10.1149/2.F07161if
X. Li, P. Ming, S. Ao, W. Wang, Review of additive electrochemical micro-manufacturing technology, International Journal of Machine Tools and Manufacture 173 (2022) 103848. https://doi.org/10.1016/j.ijmachtools.2021.103848
G. Ercolano, T. Zambelli, C. van Nisselroy, D. Momotenko, J. Vörös, T. Merle, W.W. Koelmans Multiscale additive manufacturing of metal microstructures, Advanced Engineering Materials 22 (2020) 1900961. https://doi.org/10.1002/adem.201900961
L. Hirt, R.R. Grüter, T. Berthelot, R. Cornut, J. Vörös, T. Zambelli, Local surface modification via confined electrochemical deposition with FluidFM, RSC Advances 103 (2015) 84517-84522. https://doi.org/10.1039/c5ra07239e
W. Ren, J. Xu, Z. Lian, P. Yu, H. Yu, Modeling and experimental study of the localized electrochemical micro additive manufacturing technology based on the fluidFM. Materials 13 (2020) 2783. https://doi.org/10.3390/ma13122783
G. Ercolano, C. van Nisselroy, T. Merle, J. Vörös, D. Momotenko, W. W. Koelmans, T. Zambelli Additive manufacturing of sub-micron to sub-mm metal structures with hollow AFM cantilevers, Micromachines 11 (2020) 6. https://doi.org/10.3390/mi11010006
W. Ren, J. Xu, Z. Lian, X. Sun, Z. Xu, H. Yu, Localized electrodeposition micro additive manufacturing of pure copper microstructures, International Journal of Extreme Manufacturing 4 (2021) 015101. https://doi.org/10.1088/2631-7990/ac3963
A. Ambrosi, R. D. Webster, M. Pumera, Electrochemically driven multi-material 3D-printing. Applied Materials Today 18 (2020) 100530. https://doi.org/10.1016/j.apmt.2019.100530
S. Burlison, M. Minary-Jolandan, Multiphysics simulation of microscale copper printing by confined electrodeposition using a nozzle array, Journal of Applied Physics 131 (2022) 055303. https://doi.org/10.1063/5.0072183
Y. Guo, P. Liu, P. Jiang, Y. Hua, K. Shi, H. Zheng, Y. Yang, A flow-rate-controlled double-nozzles approach for electrochemical additive manufacturing. Virtual and Physical Prototyping 17 (2022) 52-68. https://doi.org/10.1080/17452759.2021.1989751
X. Chen, X. Liu, P. Childs, N. Brandon, B. Wu, A low cost desktop electrochemical metal 3D printer, Advanced Materials Technologies 10 (2017) 1700148. https://doi.org/10.1002/admt.201700148
F. Zhang, D. Li, W. Rong, L. Yang, Y. Zhang, Study of microscale meniscus confined electrodeposition based on COMSOL, Micromachines 12 (2021) 1591. https://doi.org/10.3390/mi12121591
X. Chen, X. Liu, M. Ouyang, J. Chen, O. Taiwo, Y. Xia, P. Childs, N.P. Brandon, B. Wu, Multi-metal 4D printing with a desktop electrochemical 3D printer, Scientific Reports 9 (2019) 3973. https://doi.org/10.1038/s41598-019-40774-5
A. Kamaraj, S. Lewis, M. Sundaram, Numerical study of localized electrochemical deposition for micro electrochemical additive manufacturing, Procedia CIRP 42 (2016) 788-792. https://doi.org/10.1016/j.procir.2016.02.320
V. M. Volgin, V. V. Lyubimov, I. V. Gnidina, A. D. Davydov, T. B. Kabanova, Simulation of localized electrodeposition of microwires and microtubes, Procedia CIRP 68 (2018) 242-247. https://doi.org/10.1016/j.procir.2017.12.056
E. M. El‐Giar, R. A. Said, G. E. Bridges, D. J. Thomson, Localized electrochemical deposition of copper microstructures, Journal of The Electrochemical Society 147 (2000) 586-591. https://doi.org/10.1149/1.1393237
C. Y. Lee, C. S. Lin, B. R. Lin, Localized electrochemical deposition process improvement by using different anodes and deposition directions, Journal of Micromechanics and Microengineering 18 (2008) 105008. https://doi.org/10.1088/0960-1317/18/10/105008
J. C. Lin, T. K. Chang, J. H. Yang, Y. S. Chen, C. L. Chuang, Localized electrochemical deposition of micrometer copper columns by pulse plating, Electrochimica Acta 55 (2010) 1888-1894. https://doi.org/10.1016/j.electacta.2009.11.002
M. M. Sundaram, A. B. Kamaraj, V. S. Kumar, Mask-less electrochemical additive manufacturing: a feasibility study, Journal of Manufacturing Science and Engineering 137 (2015) 021006. https://doi.org/10.1115/1.4029022
M. Sundaram, A. B. Kamaraj, G. Lillie, Experimental study of localized electrochemical deposition of Ni-Cu alloy using a moving anode, Procedia CIRP 68 (2018) 227-231. https://doi.org/10.1016/j.procir.2017.12.053
G. Vasyliev, V. Vorobyova, D. Uschapovskiy, O. Linyucheva, Local electrochemical deposition of copper from sulfate solution, Journal of Electrochemical Science and Engineering 12 (2022) 557-563. http://dx.doi.org/10.5599/jese.1352
L.T. Romankiw, A path: from electroplating through lithographic masks in electronics to LIGA in MEMS, Electrochimica Acta 42 (1997) 2985-3005. https://doi.org/10.1016/S0013-4686(97)00146-1
H. Hu, H.J. Kim, S. Somnath, Tip-based nanofabrication for scalable manufacturing, Micromachines 8 (2017) 90–120. https://doi.org/10.3390/mi8030090
Electrode Growth Next to an Insulator, [Online]. Available: https://www.comsol.com/model/electrode-growth-next-to-an-insulator-10212
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