SIMULATION OF THE DAMAGE PROCESS OF THERMAL GLUE BOND

Authors

DOI:

https://doi.org/10.20535/kpisn.2020.4.227126

Keywords:

thermal glue, adhesive bonding, numerical modeling

Abstract

Background. Thermal glue bonding technology is widely used to create paper and paperboard packaging and polymer packaging in the chemical, food, and textile industries. To meet the needs of the consumer, it is necessary to provide a sufficient level of packaging strength and ease of use. When creating strong quality packaging, special attention should be paid to the correct selection of materials and equipment. To create a strong and reliable bond, it is necessary to understand the behavior of adhesive bonds, which depends on the following factors: type of adhesive, curing time, type of bond, the thickness of the bond line, etc. Therefore, for more efficient use of adhesive materials, it is necessary to develop reliable methods for designing and predicting the behavior of adhesive bonds.

Objective. Development of an objective test method and a method for predicting the behavior of a thermal glue bond during debonding to analyze its strength.

Methods. The article considers an integral method for determining fracture toughness, which can be used regardless of the form of the bond, as well as the linear or nonlinear behavior of the thermal glue. To predict the behavior of an thermal glue bond under load, a computer design model was developed and a numerical calculation of deformations and stresses arising in the thermal glue bond during a tensile load was carried out.

Results. The dependences of the stress in the middle of the bond on the displacement and the force at the edges of the sample on the magnitude of the tensile stroke were obtained, which makes it possible to evaluate the quality of the bond and the effect of the stiffness of the thermoplastic adhesive on the damage of the bond.

Conclusions. An analysis of the data obtained showed that the forces at the edges of the sample are directly proportional to the magnitude of the stretching stroke, and also that the destruction of the thermal glue bond occurs after reaching the ultimate strength of the adhesive, the magnitude of the stresses first increases to the limit, and then remains constant until complete damage.

References

M.D Banea and L.F.M. da Silva, “Adhesively bonded joints in composite materials: An overview”, in Proc. Institution Mech. Engineers, Part L: J. Materials: Design Applicat., vol. 223, no. 1, pp. 1–18, 2009. doi: 10.1243/14644207jmda219

T. Ungsuwarungsri and W.G. Knauss, “The role of damage-softened material behavior in the fracture of composites and adhesives”, Int. J. Fracture, vol. 35, no. 3, pp. 221–241, 1987. doi: 10.1007/bf00015590

M.D. Banea et al., “Temperature dependence of the fracture toughness of adhesively bonded joints”, J. Adhesion Sci. Technol., vol. 24, no. 11–12, pp. 2011–2026, 2010. doi: 10.1163/016942410x507713

L. Škec et al., “On Gc, Jc and the characterisation of the mode-I fracture resistance in delamination or adhesive debonding”, Int. J. Solids Structures, vol. 144–145, pp. 100–122, 2018. doi: 10.1016/j.ijsolstr.2018.04.020

Y. Herasimenko and A. Sokolskyi, “Investigation of the flexible packaging elements joining using hot melt adhesive”, Modern Eng. Innov. Technol., vol. 1, no. 11, pp. 5–8, 2020.

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Published

2021-03-23

Issue

No. 4 (2020)

Section

Статті

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Copyright (c) 2020 Oleksandr L. Sokolskyi, Yuliya Yu. Herasimenko

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